RH-2000 Nc semiconductor laser cladding system

Main Machine Power: 2000W

Wavelength: 976

Focal Length: 153mm

Facula Size: 1.5mm*4mm

Laser Device Size: 250mm*120mm*130mm

Photoelectric Conversion: 55%

Density Ratios with Carbon Dioxide Laser Power: 2.5:1

Laser Mobile Range: R=0-14m

Single cladding thickness: 0.1-3 mm

Laser Device Weight: 18Kg

Cooling Way: 1 P water-cooling

Cooling Medium: Deion water

Water Tank Size: 100mm*75mm*50mm

The machine size: 1700 mm x 165 mm x 700 mm

Control Device Size: 100mm*80mm*60mm

Numerical Control Machine Effective Mobile Distance

X-axis=1000mm, Y-axis=500mm Z-axis=700mm

Powder Feeder: Synchronous powder spraying Synchronous powder scattering